PDFKabat O.S., Kobelchuk Yu.M., Chervakov D.O., Chervakov O.V. — Ukrainian State University of Chemical Engineering, 8, Haharin Ave., Dnipro, Ukraine, 49005
POLYMER COMPOSITE MATERIALS WITH A HIGH LEVEL OF THERMAL STABILITY BASED ON PHENOLIC RESINS AND DISPERSE SILICA FILLERS
Abstract. Development of the engineering industry is difficult without using of heat-resistant polymer composite materials for manufacturing of machines and mechanisms parts operating at temperatures up to 300°C. For this purpose it was suggested the diphenylolsulfone formaldehyde resin as a polymer matrix, and
different modifications of disperse silicas — white soot WS-120 and aerosol A-380 — were selected for fillers. The developed phenoplasts have high level of thermal stability (up to 370 oC), it’s at 25–30°C is higher, then for initial resins. Apparently, this is a result of increasing of the interaction level on the boundary “polymer-disperse filler”, under the processing condition (at temperatures 170–190°C) due to appearing of covalent and hydrogen bonds between hydroxyl groups at the surface of the silica and methylol groups of the polymer matrix.
Keywords: polymeric composite materials, thermal stability, phenoplasts, silica fillers.
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